>> Friday, May 16, 2014
|©Suzie Tremmel, https://flic.kr/p/6tQ3H Creative Commons by-nc-sa 2.0|
Are you a release engineer with a great story to share? Perhaps the ingenious way that you optimized your build scripts to reduce end to end build time? Or how you optimized your cloud infrastructure to reduce your IT costs significantly? How you integrated mobile testing into your continuous integration farm? Or are you a researcher who would like to publish their latest research in a area related to release engineering?
If so, please consider submitting a report or paper to the first IEEE Release Engineering special issue. Deadline for submissions is August 1, 2014 and the special issue will be published in the Spring of 2015.
IEEE Release Engineering Special Issue
If you have any questions about the process or the special issue in general, please reach out to any of the guest editors. We're happy to help!
We're also conducting a roundtable interview with several people from the release engineering community in the issue. This should raise some interesting insights given the different perspectives that people from organizations with large scale release engineering efforts bring to the table.